Intel Off Campus Drive: Intel Off Campus hiring for Silicon Packaging Design Engineer Role for B.E / B.Tech / Diploma / BSc graduates and any batch graduates are eligible. The detailed company eligibility and application details are given below.
About Intel :
Intel’s mission is to shape the future of technology to help create a better future for the entire world. By pushing forward in fields like AI, analytics and cloud-to-edge technology, Intel’s work is at the heart of countless innovations. From major breakthroughs like self-driving cars and rebuilding the coral reefs, to things that make everyday life better like blockbuster effects and improved shopping experiences — they’re all powered by Intel technology. With a career at Intel, you have the opportunity to help make the future more wonderful for everyone.
Job Description :
Join our team as a Silicon Packaging Design Engineer in the Data Center Group, where you will play a pivotal role in crafting cutting-edge silicon packaging solutions that drive Intel’s innovation and technological leadership. In this role, you will be engaged in the end-to-end development of substrate designs, from concept to tapeout, ensuring optimized performance and manufacturability. Collaborating closely with cross-functional teams, your contributions will directly impact product quality, cost efficiency, and time-to-market for Intel’s next-generation technologies. This is an exciting opportunity to start your career in a collaborative environment that fosters learning and professional growth.
Job Title : Silicon Packaging Design Engineer
Job Type : Full Time
Location : Bangalore
Experience : Fresher
Role and Responsibility :
- Drive the complete development of substrate designs, starting from initial concept through tapeout.
- Perform physical layout and routing of package designs, ensuring adherence to design requirements.
- Conduct substrate fit and routing studies to establish optimal tradeoffs between design, performance, and cost.
- Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout configurations.
- Define and implement substrate design rules to meet product and manufacturing requirements.
- Perform internal and external design reviews, analyze data, and resolve design rule violations (DRCs).
- Integrate design documentation and collateral into the product lifecycle management system.
- Continuously seek opportunities to improve package design for manufacturability (DFM) and quality assurance.
Education and Skills :
- Minimum Qualifications
- Diploma in Electronic/ Electrical Engineering or a related field.
- six months or more years of work experience in Semiconductor field related to design of silicon packaging or PCB.
- Novice to intermediate proficiency in substrate design and development, including physical layout and routing.
- Basic understanding of I/O fundamentals, package interconnect, and power delivery principles.
- Familiarity with design for manufacturability (DFM) and quality assurance processes.
- Strong problem-solving skills with a disciplined approach to execution.
How To Apply Intel Off Campus Drive ??
All interested and eligible candidates can apply before expire in the following link.
Apply Link : Click Here
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